会议名称：主题峰会2：车规级芯片技术突破与产业化发展

　　英文名称：Summit2: Technical Breakthrough and Industrialization of Automotive Chip

　　时间地点：9月15日，14:00-16:30，海南国际会展中心二层2号厅

　　Date & Venue: September 15, 14:00-16:30, 2nd Floor, Banquet Hall 2, North District (Phase Ⅱ Project), Hainan International Convention and Exhibition Center

　　会议内容：随着汽车向电动化、网联化、智能化方向发展，芯片已成为支撑汽车产业转型升级的关键。此次全球芯片供应危机更加突显了芯片对汽车行业的重要影响。汽车与芯片的深度融合正在孕育新的产业生态。本次峰会将围绕汽车电动化、智能化需求，聚焦汽车产业深度变革对芯片的机遇和挑战、智能汽车发展对汽车芯片的要求、下一代电气架构下芯片的发展方向、第三代半导体技术的突破和应用、自主汽车芯片产业化发展路径等内容展开研讨。

　　Contents: With the development of vehicles towards electrification, connection and intelligence, chips have become the key to support the transformation and upgrading of the automotive industry. The global chip supply crisis has highlighted the important impact of chips on the automotive industry. The deep integration of vehicles and chips is generating a new industrial ecology. This summit will focus on the needs of automotive electrification and intelligence, and conduct discussions on the opportunities and challenges facing chips brought by the deep transformation of the automotive industry, the requirements of smart automotive development to chips, the development direction of chips under the next generation electrical architecture, the breakthrough and application of the third generation semiconductor technology, and the development path of the industrialization of independent automotive chips.

　　会议主席 / Presidents of the Congress:

　　吴汉明 / WU Hanming

　　中国工程院院士、浙江大学微纳电子学院院长

　　Academician of Chinese Academy of Engineering

　　Dean of the School of Micro-Nano Electronics of Zhejiang University

　　主持人 / Moderator: 

　　原诚寅 / YUAN Chengyin

　　国家新能源汽车技术创新中心总经理

　　General Manager, National New Energy Vehicle Technology Innovation Center

　　会议日程/Agenda